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Printed Circuits Handbook, 7th Edition

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Title: Printed Circuits Handbook, 7th Edition
Author: Clyde F. Coombs, Happy Holden
ISBN: 0071833951 / 9780071833950
Format: Hard Cover
Pages: 1648
Publisher: McGraw-Hill
Year: 2016
Availability: 15-30 days
     
 
  • Description
  • Contents

The Most Complete and Widely Used Guide to Printed Circuits, Now Updated and Thoroughly Revised

The Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance.

Written by a team of experts from around the world, this encyclopedic resource has been thoroughly revised and expanded to include the latest printed circuit tools and technologies - from design to fabrication. Hundreds of illustrations and charts demonstrate key concepts, and valuable tables provide quick and easy access to essential information.

This new edition of the most trusted guide to printed circuits includes:

  • Introduction to Printed Circuits
  • Supply Chain Management
  • Lead-Free Materials and Processes
  • Engineering and Design of Printed Circuits
  • Base Materials for All Applications
  • Fabrication Processes
  • High Density Interconnection
  • Bare Board Testing
  • Assembly Processes
  • Soldering Materials and Processes
  • Non-Solder Interconnection
  • Quality Specification and Assessment
  • Reliability Prediction and Assessment
  • Assembly Testing
  • Repair and Rework
  • Flexible Circuits
  • And Much More

Preface

Part 1 : Printed Circuit Technology Drivers
Chapter 1 :
Electronic Packaging and High-Density Interconnectivity
Chapter 2 : Types of Printed Wiring Boards

Part 2 : Managing the Printed Circuit Supply Chain
Chapter 3 :
Basics of Printed Circuit Supply Chain Management
Chapter 4 : Design for Manufacturability
Chapter 5 : Manufacturing Information, Documentation, Formatting, and Exchange
Chapter 6 : Supplier Selection and Qualification
Chapter 7 : Process Control, Monitoring, and Incoming Inspection
Chapter 8 : Product Acceptance and Feedback

Part 3 : Materials
Chapter 9 :
Introduction to Base Materials
Chapter 10 : Base Material Components
Chapter 11 : Properties of Base Materials
Chapter 12 : Base Material Performance in PCBs
Chapter 13 : The Impact of Lead-Free Assembly on Base Materials
Chapter 14 : Selecting Base Materials
Chapter 15 : Laminate Qualification and Testing

Part 4 : Engineering and Design
Chapter 16 :
Planning for Design, Fabrication, and Assembly
Chapter 17 : Physical Characteristics of the PCB
Chapter 18 : Electronic Design Automation and Printed Circuit Design Tools
Chapter 19 : The PCB Design Process
Chapter 20 : Electrical and Mechanical Design Parameters
Chapter 21 : The Basics of Printed Circuit Board Design
Chapter 22 : Current Carrying Capacity in Printed Circuits
Chapter 23 : PCB Design for Thermal Performance
Chapter 24 : Embedded Components

Part 5 : High-Density Interconnection
Chapter 25 :
Introduction to High-Density Interconnection Technology
Chapter 26 : Advanced High-Density Interconnection Technologies

Part 6 : Fabrication
Chapter 27 :
CAM Tooling for Fab and Assembly
Chapter 28 : Drilling Processes
Chapter 29 : Precision Interconnect and Laser Drilling
Chapter 30 : Imaging and Automated Optical Inspection
Chapter 31 : Multilayer Materials and Processing
Chapter 32 : Preparing Boards for Plating
Chapter 33 : Electroplating
Chapter 35 : Printed Circuit Board Surface Finishes
Chapter 36 : Solder Mask
Chapter 37 : Etching Process and Technologies
Chapter 38 : Routing and V-Scoring

Part 7 : Bare Board Test
Chapter 39 :
Bare Board Test Objectives and Definitions
Chapter 40 : Bare Board Test Methods
Chapter 41 : Bare Board Test Equipment
Chapter 42 : HDI Bare Board Special Testing Methods

Part 8 : Assembly, Soldering Materials, and Processes
Chapter 43 :
Assembly Processes
Chapter 44 : Conformal Coating
Chapter 45 : Fluxes and Cleaning
Chapter 46 : Soldering Fundamentals
Chapter 47 : Soldering Materials and Metallurgy
Chapter 48 : Solder Fluxes
Chapter 49 : Soldering Techniques
Chapter 50 : Soldering Repair and Rework

Part 9 : Nonsolder Interconnection
Chapter 51 :
Press-Fit Interconnection
Chapter 52 : Pressure-Interconnect Land Grid Array Systems

Part 10 : Quality
Chapter 53 :
Acceptability and Quality of Fabricated Boards
Chapter 54 : Acceptability of Printed Circuit Board Assemblies
Chapter 55 : Asssembly Inspection
Chapter 56 : Design for Testing
Chapter 57 : Loaded Board Testing
Chapter 58 : Failure Modes and Effects Analysis

Part 11 : Reliability
Chapter 59 :
Conductive Anodic Filament Formation
Chapter 60 : Reliability of Printed Circuit Boards
Chapter 61 : Reliability of Microvia Printed Circuit Boards
Chapter 62 : Component-to-PWB Reliability : The Impact of Design Variables and Lead Free
Chapter 63 : Lead-Free Solder Joint Reliability : Fundamentals and Design-for-Reliability Rules
Chapter 64 : Component-to-PWB Reliability : Estimating Solder Joint Reliability and the Impact of Lead-Free Solders

Part 12 : Flexible Circuits
Chapter 65 :
Flexible Circuit Applications and Materials
Chapter 66 : Design of Flexible Circuits
Chapter 67 : Manufacturing Flexible Circuits
Chapter 68 : Termination Options for Flexible Circuits
Chapter 69 : Multilayer Flex and Rigid Flex
Chapter 70 : Special Constructions of Flexible Circuits
Chapter 71 : Flexible Circuit Quality Assurance : Principles and Practices

Appendix : Summary of Key Component, Material, Process, and Design Standards
Glossary
Index

 
 
 
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