Title: Printed Circuits Handbook, 7th Edition Author: Clyde F. Coombs, Happy Holden ISBN: 0071833951 / 9780071833950 Format: Hard Cover Pages: 1648 Publisher: McGraw-Hill Year: 2016 Availability: 45-60 days
Description
Contents
The Most Complete and Widely Used Guide to Printed Circuits, Now Updated and Thoroughly Revised
The Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance.
Written by a team of experts from around the world, this encyclopedic resource has been thoroughly revised and expanded to include the latest printed circuit tools and technologies - from design to fabrication. Hundreds of illustrations and charts demonstrate key concepts, and valuable tables provide quick and easy access to essential information.
This new edition of the most trusted guide to printed circuits includes:
Introduction to Printed Circuits
Supply Chain Management
Lead-Free Materials and Processes
Engineering and Design of Printed Circuits
Base Materials for All Applications
Fabrication Processes
High Density Interconnection
Bare Board Testing
Assembly Processes
Soldering Materials and Processes
Non-Solder Interconnection
Quality Specification and Assessment
Reliability Prediction and Assessment
Assembly Testing
Repair and Rework
Flexible Circuits
And Much More
Preface
Part 1 : Printed Circuit Technology Drivers
Chapter 1 : Electronic Packaging and High-Density Interconnectivity Chapter 2 : Types of Printed Wiring Boards
Part 2 : Managing the Printed Circuit Supply Chain
Chapter 3 : Basics of Printed Circuit Supply Chain Management Chapter 4 : Design for Manufacturability Chapter 5 : Manufacturing Information, Documentation, Formatting, and Exchange Chapter 6 : Supplier Selection and Qualification Chapter 7 : Process Control, Monitoring, and Incoming Inspection Chapter 8 : Product Acceptance and Feedback
Part 3 : Materials
Chapter 9 : Introduction to Base Materials Chapter 10 : Base Material Components Chapter 11 : Properties of Base Materials Chapter 12 : Base Material Performance in PCBs Chapter 13 : The Impact of Lead-Free Assembly on Base Materials Chapter 14 : Selecting Base Materials Chapter 15 : Laminate Qualification and Testing
Part 4 : Engineering and Design
Chapter 16 : Planning for Design, Fabrication, and Assembly Chapter 17 : Physical Characteristics of the PCB Chapter 18 : Electronic Design Automation and Printed Circuit Design Tools Chapter 19 : The PCB Design Process Chapter 20 : Electrical and Mechanical Design Parameters Chapter 21 : The Basics of Printed Circuit Board Design Chapter 22 : Current Carrying Capacity in Printed Circuits Chapter 23 : PCB Design for Thermal Performance Chapter 24 : Embedded Components
Part 5 : High-Density Interconnection
Chapter 25 : Introduction to High-Density Interconnection Technology Chapter 26 : Advanced High-Density Interconnection Technologies
Part 6 : Fabrication
Chapter 27 : CAM Tooling for Fab and Assembly Chapter 28 : Drilling Processes Chapter 29 : Precision Interconnect and Laser Drilling Chapter 30 : Imaging and Automated Optical Inspection Chapter 31 : Multilayer Materials and Processing Chapter 32 : Preparing Boards for Plating Chapter 33 : Electroplating Chapter 35 : Printed Circuit Board Surface Finishes Chapter 36 : Solder Mask Chapter 37 : Etching Process and Technologies Chapter 38 : Routing and V-Scoring
Part 7 : Bare Board Test
Chapter 39 : Bare Board Test Objectives and Definitions Chapter 40 : Bare Board Test Methods Chapter 41 : Bare Board Test Equipment Chapter 42 : HDI Bare Board Special Testing Methods