Title: More Hot Air Author: Tony Kordyban ISBN: 079180223X / 9780791802236 Format: Soft Cover Pages: 300 Publisher: ASME Year: 2005 Availability: 45-60 days
Description
Contents
More Hot Air is the long-awaited sequel to the author's previous ASME Press book, Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong. This new book continues in the same humorous and easy-to-read style of the earlier book, with all-new, original case studies in the field of electronics cooling. Each case study, told as an anecdote, is designed to teach a basic concept of heat transfer, as applied to keeping electronics from overheating.
Because of the constantly shrinking size of electronics, the job of cooling electronics continues to get tougher. Many people not trained in the basics of heat transfer have been roped into doing this job out of necessity. For those who lack any formal training in heat transfer, the case studies explode many of the myths about cooling electronics and replace these flawed practices with sound engineering, based on actual heat transfer theory.
The case studies and humor in this book are also entertaining to those well versed in electronics cooling. A must-read book for all engineers and their managers concerned with electronics packaging.
Introduction
Measurement and Test: Getting the Wrong Answer Direct from the Lab
Chapter 1.1 : The Best Worst Case Chapter 1.2 : Blowing the Rel Test Chapter 1.3 : The Five-Finger Thermometer Chapter 1.4 : T-types Fried My Brain Chapter 1.5 : Permutations and Combinations Add Up to Job Security Chapter 1.6 : Power Confuses, and Variable Power Confuses Absolutely Chapter 1.7 : How to Get Percent Error 100% Wrong Chapter 2.1 : Elbow Room Chapter 2.2 : Breathing Room Chapter 2.3 : The Path of Least Resistance Chapter 2.4 : Incomprehensible Flow Chapter 2.5 : Fault-Tolerant Cooling Chapter 2.6 : Putting the Right Spin on Fan Cooling Chapter 2.7 : Degrees C and dBs Chapter 2.8 : WKUL-AM Chapter 3.1 : Not Working Within the Limits Chapter 3.2 : Don't Blow It When Sizing a Fuse Chapter 3.3 : When It's Hot, They All Go in the Pool Chapter 3.4 : Bypass Capacitors? Chapter 3.5 : A Baffling Temperature Rise Chapter 3.6 : 24K Gold Heat Sinks: Worth Their Weight in Aluminum Chapter 3.7 : Improving the Weakest Player Chapter 3.8 : Getting Lost in the Cracks Chapter 4.1 : Seeing (Infra) Red Chapter 4.2 : The Beauty of IR Is Only Skin Deep Chapter 4.3 : "Negative Result--Very Important, Too!" Chapter 4.4 : Selective Surfaces Chapter 5.1 : Circuit Board Not Included Chapter 5.2 : Thermal I/O Chapter 5.3 : JEDEC Standard: Stake in the Ground, or Stick in the Mud? Chapter 6.1 : The Milk-box Problem Chapter 6.2 : Specs, Lies and Red Tape Chapter 6.3 : Thinking Kinks Jinx Sinks Chapter 6.4 : The Magic Pipe Chapter 6.5 : When 6% Is 44% Chapter 6.6 : So Crazy, It Just Might Work Chapter 7.1 : Thinking Inside the Box Chapter 7.2 : "Just Slap It in an ETSI Cabinet and Voila!" Chapter 7.3 : NEBS: the Bible of the Central Office Chapter 7.4 : The New NEBS: More a Horror Tale Than Another Bible Chapter 7.5 : Normal Room Temperature: the Latest Worst-Case Thermal Condition Chapter 7.6 : The Weakest Link in Air Cooling