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IS 10098 : 1982
Capturing Client Requirements in Construction Projects
IEC 62040-3:2021 :
IEC 62035:2014 :
Law Without Lawyers, Justice Without Courts : On Traditional Chinese Mediation
 
 
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IEC Standards

 Total Items : 8295
 

IEC 62040-4:2013 :

Uninterruptible power systems (UPS) - Part 4: Environmental aspects - Requirements and reporting

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IEC 62040-5-3:2016 :

Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements

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IEC 62041:2017 :

Transformers, power supplies, reactors and similar products - EMC requirements

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IEC 62044-1:2002 :

Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specification

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IEC 62044-2:2005 :

Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level

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IEC 62044-3:2000 :

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level

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IEC 62046:2018 :

Safety of machinery - Application of protective equipment to detect the presence of persons

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IEC 62047-10:2011 :

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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IEC 62047-11:2013 :

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

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IEC 62047-12:2011 :

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

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IEC 62047-13:2012 :

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

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IEC 62047-14:2012 :

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

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IEC 62047-16:2015 :

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

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IEC 62047-17:2015 :

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

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IEC 62047-18:2013 :

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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IEC 62047-19:2013 :

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

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IEC 62047-1:2016 :

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

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IEC 62047-20:2014 :

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

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IEC 62047-21:2014 :

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

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IEC 62047-22:2014 :

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

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IEC 62047-25:2016 :

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

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IEC 62047-26:2016 :

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

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IEC 62047-27:2017 :

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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IEC 62047-28:2017 :

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

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IEC 62047-29:2017 :

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

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