Wire Bonding in Microelectronics, 3rd Edition (With CD-Rom)

The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

• Ultrasonic bonding systems and technologies, including high-frequency systems
• Bonding wire metallurgy and characteristics, including copper wire
• Wire bond testing
• Gold-aluminum intermetallic compounds and other interface reactions
• Gold and nickel-based bond pad plating materials and problems
• Cleaning to improve bondability and reliability
• Mechanical problems in wire bonding
• High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds
• Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
• Wire bonding process modeling and simulation

Introduction to Third Edition
Acknowledgments
Introduction to CD

Chapter 1 : The Technical Introduction to the Third Edition
Chapter 2 : Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
Chapter 3 : Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing
Chapter 4 : Wire Bond Testing
Chapter 5 : Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding
Chapter 6 : Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability
Chapter 7 : Cleaning to Improve Bondability and Reliability
Chapter 8 : Mechanical Problems in Wire Bonding
Chapter 9 : Advanced and Specialized Wire Bonding Technologies
Chapter 10 : An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging
Chapter 11 : Wire Bonding Process Modeling and Simulation

Glossary
Bibliography
Index