Title: Through-Silicon Vias for 3D Integration Author: John H. Lau ISBN: 0071785140 / 9780071785143 Format: Hard Cover Pages: 512 Publisher: McGraw-Hill Year: 2012 Availability: 45-60 days
Description
Contents
A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies : Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
Nanotechnology and 3D integration for the semiconductor industry
TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
TSVs : mechanical, thermal, and electrical behaviors
Thin-wafer strength measurement
Wafer thinning and thin-wafer handling
Microbumping, assembly, and reliability
Microbump electromigration
Transient liquid-phase bonding : C2C, C2W, and W2W
2.5D IC integration with interposers
3D IC integration with interposers
Thermal management of 3D IC integration
3D IC packaging
Preface
Chapter 1 : Introduction to Microelectronics and Nanoelectronics Chapter 2 : Origin and Evolution of 3D Integration Chapter 3 : Trends and Outlook of 3D IC Packaging Chapter 4 : Through-Silicon Vias (TSVs) Technology Chapter 5 : Challenges and Outlook of 3D Si Integration Chapter 6 : Challenges and Outlook of 3D IC Integration Chapter 7 : Thin-Wafer Strength Measurements Chapter 8 : Thin-Wafer Handling Chapter 9 : Low-Cost Microbumping Chapter 10 : C2C and C2W Bonding with Microbumps Chapter 11 : Low Temperature Bonding Chapter 12 : Electromigration of Microbump Assemblies Chapter 13 : Memory Stacking Methods Chapter 14 : Active TSV Interposers Chapter 15 : Passive TSV Interposers Chapter 16 : Thermal Management of 3D IC Integration Chapter 17 : 3D IC and CIS Integration Chapter 18 : 3D IC and MEMS Integration Chapter 19 : 3D IC and LED Integration Chapter 20 : Embedded 3D Hybrid IC and Opto-electronic Integration in Organic Substrates