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Thermal Management Handbook for Electronic Assemblies

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Title: Thermal Management Handbook for Electronic Assemblies
Author: Al Krum, Jerry E. Sergent
ISBN: 0070266999 / 9780070266995
Format: Hard Cover
Pages: 650
Publisher: McGraw-Hill
Year: 1998
Availability: In Stock
     
 
  • Description
  • Contents

In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges -- and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage -- and preventing thermal-related problems from occurring in the first place.

Preface

Chapter 1 : Introduction, Jerry Sergent and Al Krum
Chapter 2 : Thermal Effects on Electronic Circuits, Jerry Sergent
Chapter 3 : Thermal Properties of Electronic Material, Thomas C. Evans
Chapter 4 : Heat Generation in Electronic Circuits, Al Krum and Jerry Sergent
Chapter 5 : Basic Thermal Analysis, Al Krum
Chapter 6 : Computer-Based Thermal Analysis, Debabrata Pal and Garron K. Morris
Chapter 7 : Thermal Management, Jerry Sergent
Chapter 8 : Electronic Device Cooling, Richard F. Porter and Ohbin Kwon

Index

 
 
 
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