Title: Thermal Management Handbook for Electronic Assemblies Author: Al Krum, Jerry E. Sergent ISBN: 0070266999 / 9780070266995 Format: Hard Cover Pages: 650 Publisher: McGraw-Hill Year: 1998 Availability: In Stock
Description
Contents
In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges -- and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage -- and preventing thermal-related problems from occurring in the first place.
Preface
Chapter 1 : Introduction, Jerry Sergent and Al Krum Chapter 2 : Thermal Effects on Electronic Circuits, Jerry Sergent Chapter 3 : Thermal Properties of Electronic Material, Thomas C. Evans Chapter 4 : Heat Generation in Electronic Circuits, Al Krum and Jerry Sergent Chapter 5 : Basic Thermal Analysis, Al Krum Chapter 6 : Computer-Based Thermal Analysis, Debabrata Pal and Garron K. Morris Chapter 7 : Thermal Management, Jerry Sergent Chapter 8 : Electronic Device Cooling, Richard F. Porter and Ohbin Kwon