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John Lau

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Advanced MEMS Packaging

Author: C. Premachandran, Cheng Lee, John Lau, Yu Aibin
ISBN: 0071626239 / 9780071626231
Year: 2010
Availability: In Stock
Comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created...
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