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IEC 60191-2:1966/AMD13:2006 :
IEC 60127-2:2014+AMD1:2020 CSV :
IEC 60141-1:1993 :
IEC 60115-2:2014 :
IEC 60115-1:2020 :
 
 
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IEC Standards

 Total Items : 8295
 

IEC 60191-6-18:2010 :

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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IEC 60191-6-19:2010 :

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

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IEC 60191-6-1:2001 :

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

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IEC 60191-6-20:2010 :

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

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IEC 60191-6-21:2010 :

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

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IEC 60191-6-22:2012 :

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

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List Price: Sfr 115
 

IEC 60191-6-2:2001 :

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

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IEC 60191-6-3:2000 :

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

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IEC 60191-6-4:2003 :

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

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List Price: Sfr 75
 

IEC 60191-6-5:2001 :

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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IEC 60191-6-6:2001 :

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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List Price: Sfr 75
 

IEC 60191-6-8:2001 :

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

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IEC 60191-6:2009 :

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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List Price: Sfr 220
 

IEC 60192:2001 :

Low-pressure sodium vapour lamps - Performance specifications

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IEC 60193:2019 :

Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests

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IEC 60194-1:2021 :

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

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IEC 60194-2:2017 :

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

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List Price: Sfr 260
 

IEC 60195:2016 :

Method of measurement of current noise generated in fixed resistors

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IEC 60196:2009 :

IEC standard frequencies

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IEC 60197:1965 :

High-voltage connecting wire with flame retarding insulation for use in television receivers

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IEC 60204-11:2018 :

Safety of machinery - Electrical equipment of machines - Part 11: Requirements for equipment for voltages above 1 000 V AC or 1 500 V DC and not exceeding 36 kV

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List Price: Sfr 290
 

IEC 60204-1:2016+AMD1:2021 CSV :

Safety of machinery - Electrical equipment of machines - Part 1: General requirements

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List Price: Sfr 520
 

IEC 60204-1:2016/AMD1:2021 :

Amendment 1 - Safety of machinery - Electrical equipment of machines - Part 1: General requirements

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IEC 60204-31:2013 :

Safety of machinery - Electrical equipment of machines - Part 31: Particular safety and EMC requirements for sewing machines, units and systems

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IEC 60204-32:2008 :

Safety of machinery - Electrical equipment of machines - Part 32: Requirements for hoisting machines

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List Price: Sfr 380
 
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