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IEC 60095-4:2021 :
IEC 60169-7:1975 :
IEC 60151-20:1969 :
IEC 60191-2:1966/AMD20:2018 :
IEC 60127-3:2015/AMD1:2020 :
 
 
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IEC Standards

 Total Items : 8295
 

IEC 60191-2:1966/AMD21:2020 :

Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2:1966/AMD2:2001 :

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2:1966/AMD3:2001 :

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2:1966/AMD4:2001 :

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2:1966/AMD5:2002 :

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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IEC 60191-2:1966/AMD6:2002 :

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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IEC 60191-2:1966/AMD7:2002 :

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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IEC 60191-2:1966/AMD8:2003 :

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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IEC 60191-2:1966/AMD9:2003 :

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2T:1996 :

Eighteenth supplement

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IEC 60191-2U:1997 :

Nineteenth supplement

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IEC 60191-2V:1998 :

Twentieth supplement

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IEC 60191-2W:1999 :

Twenty-first supplement

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IEC 60191-2X:1999 :

Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2Y:2000 :

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-2Z:2000 :

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-3:1999 :

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

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IEC 60191-4:2013+AMD1:2018 CSV :

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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IEC 60191-4:2013/AMD1:2018 :

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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IEC 60191-5:1997 :

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

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IEC 60191-6-10:2003 :

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

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IEC 60191-6-12:2011 :

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

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IEC 60191-6-13:2016 :

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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IEC 60191-6-16:2007 :

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

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IEC 60191-6-17:2011 :

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

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