Thermal Management of Microelectronic Equipment : Heat Transfer Theory, Analysis Methods, and Design Practices, 2nd Edition

This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems.

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.

The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids.  The authors are recognized experts in the field of thermal management of electronic systems and have a combined 80-plus years of experience in the defense and commercial industries.

List of Figures
List of Tables
Nomenclature
Foreword
Preface

Chapter 1 : Introduction
Chapter 2 : Conduction
Chapter 3 : Convection
Chapter 4 : Radiation
Chapter 5 : Pool Boiling
Chapter 6 : Flow Boiling
Chapter 7 : Condensation
Chapter 8 : Extended Surfaces
Chapter 9 : Thermal Interface Resistance
Chapter 10 : Component and Printed Circuit Board
Chapter 11 : Direct Air Cooling and Fans
Chapter 12 : Natural and Mixed Convection
Chapter 13 : Heat Exchangers and Cold Plates
Chapter 14 : Advanced Cooling Technologies I : Single-Phase Liquid Cooling
Chapter 15 : Advanced Cooling Technologies II : Two-Phase Flow Cooling
Chapter 16 : Heat Pipes and Others
Chapter 17 : Thermoelectric Devices
Chapter 18 : Microwave Modules and GaAs Chips

Appendices
Appendix A : Material Thermal Properties
Appendix B : Thermal Conductivity of Silicon and Gallium Arsenide
Appendix C : Properties of Air, Water, and Dielectric Fluids
Appendix D : Typical Emissivities of Materials
Appendix E : Solar Absorptivities and Emissivities of Common Surfaces
Appendix F : Properties of Phase-Change Materials
Appendix G : Friction Factor Correlations
Appendix H : Heat Transfer Correlations
Appendix I : Units Conversion Table
Index
About the Author