Includes chapters contributed by IEEE members and industry experts on the latest technologies in electronic devices and systems packaging Covers a range of applied technologies and concepts that are necessary to allow the user to follow reasonable steps to reach a defined goal Focuses on key issues facing the packaging industry, including efficiency vs. cost considerations, EMI/RFI issues, electronic design automation, thermal management, and connector technologies Provides a "Where Else?" section in each chapter which guides the reader to other sections of the handbook where similar issues are discussed
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.
The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.
Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.
Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Chapter 1 : Fundamentals of the Design Process
Chapter 2 : Surface Mount Technology
Chapter 3 : Integrated Circuit Packages
Chapter 4 : Direct Chip Attach
Chapter 5 : Circuit Boards
Chapter 6 : EMC and PCB Design
Chapter 7 : Hybrid Assemblies
Chapter 8 : Interconnects
Chapter 9 : Design for Test
Chapter 10 : Adhesive and Its Application
Chapter 11 : Thermal Management
Chapter 12 : Testing
Chapter 13 : Inspection
Chapter 14 : Package/Enclosure
Chapter 15 : Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
Chapter 16 : Product Safety and Third-Party Certification
Appendix A : Definitions
Index
