More Hot Air

More Hot Air is the long-awaited sequel to the author's previous ASME Press book, Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong. This new book continues in the same humorous and easy-to-read style of the earlier book, with all-new, original case studies in the field of electronics cooling. Each case study, told as an anecdote, is designed to teach a basic concept of heat transfer, as applied to keeping electronics from overheating.

Because of the constantly shrinking size of electronics, the job of cooling electronics continues to get tougher. Many people not trained in the basics of heat transfer have been roped into doing this job out of necessity. For those who lack any formal training in heat transfer, the case studies explode many of the myths about cooling electronics and replace these flawed practices with sound engineering, based on actual heat transfer theory.

The case studies and humor in this book are also entertaining to those well versed in electronics cooling. A must-read book for all engineers and their managers concerned with electronics packaging.
 

Introduction
Measurement and Test: Getting the Wrong Answer Direct from the Lab

Chapter 1.1 : The Best Worst Case
Chapter 1.2 : Blowing the Rel Test
Chapter 1.3 : The Five-Finger Thermometer
Chapter 1.4 : T-types Fried My Brain
Chapter 1.5 : Permutations and Combinations Add Up to Job Security
Chapter 1.6 : Power Confuses, and Variable Power Confuses Absolutely
Chapter 1.7 : How to Get Percent Error 100% Wrong
Chapter 2.1 : Elbow Room
Chapter 2.2 : Breathing Room
Chapter 2.3 : The Path of Least Resistance
Chapter 2.4 : Incomprehensible Flow
Chapter 2.5 : Fault-Tolerant Cooling
Chapter 2.6 : Putting the Right Spin on Fan Cooling
Chapter 2.7 : Degrees C and dBs
Chapter 2.8 : WKUL-AM
Chapter 3.1 : Not Working Within the Limits
Chapter 3.2 : Don't Blow It When Sizing a Fuse
Chapter 3.3 : When It's Hot, They All Go in the Pool
Chapter 3.4 : Bypass Capacitors?
Chapter 3.5 : A Baffling Temperature Rise
Chapter 3.6 : 24K Gold Heat Sinks:  Worth Their Weight in Aluminum
Chapter 3.7 : Improving the Weakest Player
Chapter 3.8 : Getting Lost in the Cracks
Chapter 4.1 : Seeing (Infra) Red
Chapter 4.2 : The Beauty of IR Is Only Skin Deep
Chapter 4.3 : "Negative Result--Very Important, Too!"
Chapter 4.4 : Selective Surfaces
Chapter 5.1 : Circuit Board Not Included
Chapter 5.2 : Thermal I/O
Chapter 5.3 : JEDEC Standard:  Stake in the Ground, or Stick in the Mud?
Chapter 6.1 : The Milk-box Problem
Chapter 6.2 : Specs, Lies and Red Tape
Chapter 6.3 : Thinking Kinks Jinx Sinks
Chapter 6.4 : The Magic Pipe
Chapter 6.5 : When 6% Is 44%
Chapter 6.6 : So Crazy, It Just Might Work
Chapter 7.1 : Thinking Inside the Box
Chapter 7.2 : "Just Slap It in an ETSI Cabinet and Voila!"
Chapter 7.3 : NEBS:  the Bible of the Central Office
Chapter 7.4 : The New NEBS:  More a Horror Tale Than Another Bible
Chapter 7.5 : Normal Room Temperature:  the Latest Worst-Case Thermal Condition
Chapter 7.6 : The Weakest Link in Air Cooling

Index