Extreme Environment Electronics

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space.

The Definitive Guide to Extreme Environment Electronics

Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.

Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material.

With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Preface

Part I : Introduction
Chapter 1 : Big Picture and Some History of the Field
Chapter 2 : Extreme Environments in NASA Planetary Exploration
Chapter 3 : Extreme Environment Electronics in NASA’s Heliophysics Vision
Chapter 4 : Overview of the NASA ETDP RHESE Program
Chapter 5 : Role of Extreme Environment Electronics in NASA’s Aeronautics Research
Chapter 6 : Technology Options for Extreme Environment Electronics

Part II : Background
Chapter 7 : Introduction
Chapter 8 : Physics of Temperature and Temperature’s Role in Carrier Transport
Chapter 9 : Overview of Radiation Transport Physics and Component Effects
Chapter 10 : Interaction of Radiation with Semiconductor Devices

Part III : Environments and Prediction Tools
Chapter 11 : Introduction
Chapter 12 : Orbital Radiation Environments
Chapter 13 : CRÈME96 and Related Error Rate Prediction Methods
Chapter 14 : Monte Carlo Simulation of Radiation Effects
Chapter 15 : Extreme Environments in Energy Production and Utilization
Chapter 16 : Extreme Environments in Transportation

Part IV : Semiconductor Device Technologies for Extreme Environments
Chapter 17 : Introduction
Chapter 18 : Radiation Effects in Si CMOS Platforms
Chapter 19 : Wide Temperature Range Operation of Si CMOS Platforms
Chapter 20 : Trade-Offs between Performance and Reliability in Sub-100 nm RF-CMOS on SOI Technologies
Chapter 21 : SiGe HBT Platforms
Chapter 22 : Using Temperature to Explore the Scaling Limits of SiGe HBTs
Chapter 23 : SiC Integrated Circuit Platforms for High-Temperature Applications
Chapter 24 : Passive Elements in Silicon Technology
Chapter 25 : Power Device Platforms
Chapter 26 : CMOS-Compatible Silicon-on-Insulator MESFETs for Extreme Environments
Chapter 27 : III-Nitride Platforms
Chapter 28 : Photonic Devices
Chapter 29 : Radiation Hardening by Process
Chapter 30 : Rad-Hard Silicon Technologies at BAE Systems
Chapter 31 : Rad-Hard Silicon Technologies at Honeywell
Chapter 32 : High-Temperature SOI Technologies at Honeywell

Part V : Modeling for Extreme Environment Electronic Design
Chapter 33 : Introduction
Chapter 34 : TCAD of Advanced Transistors
Chapter 35 : Mixed-Mode TCAD Tools
Chapter 36 : Mixed-Mode TCAD for Modeling of Single-Event Effects
Chapter 37 : Compact Modeling of SiGe HBTs
Chapter 38 : Compact Modeling of CMOS Devices for Extreme Environments
Chapter 39 : Compact Modeling of LDMOS Transistors
Chapter 40 : Compact Modeling of Power Devices
Chapter 41 : Best Practices for Modeling Radiation Effects in Mixed Signal Circuits
Chapter 42 : Compact Model Toolkits

Part VI : Device and Circuit Reliability in Extreme Environments
Chapter 43 : Introduction
Chapter 44 : Failure Mechanisms in Modern Integrated Circuits and Industry Best Practices for Reliability Degradation Predictions
Chapter 45 : Considerations for the Reliability Estimation of SiGe HBTs
Chapter 46 : Considerations for the Reliability Estimation of Silicon CMOS
Chapter 47 : Qualification Methodology for Extreme Environment Electronics

Part VII : Circuit Design for Extreme Environments
Chapter 48 : Introduction
Chapter 49 : Best Practices in Radiation Hardening by Design
Chapter 50 : Investigations of RHBD Techniques for SiGe Devices and Circuits
Chapter 51 : Best Practices in Wide Temperature Range Circuit Design
Chapter 52 : Achieving Invariability in Analog Circuits Operating in Extreme Environments

Part VIII : Examples of Extreme Environment Circuit Designs
Chapter 53 : Introduction
Chapter 54 : Voltage and Current References
Chapter 55 : Operational Amplifiers
Chapter 56 : Cryogenic Low-Noise Amplifiers
Chapter 57 : Active Filters
Chapter 58 : Analog-to-Digital Converters
Chapter 59 : Digital-to-Analog Converters
Chapter 60 : CMOS Phase-Locked Loops
Chapter 61 : Low-Voltage, Weakly Saturated SiGe HBT Circuits
Chapter 62 : Memory Circuits
Chapter 63 : Field Programmable Gate Arrays
Chapter 64 : Microprocessors and Microcontrollers
Chapter 65 : Asynchronous Digital Circuits
Chapter 66 : Characterizing SETs in Oscillator Circuits
Chapter 67 : Low-Voltage Power Electronics
Chapter 68 : Medium-Voltage Power Electronics
Chapter 69 : SiC JFET Integrated Circuits for Extreme Environment Electronics
Chapter 70 : Using CMOS-Compatible SOI MESFETs for Power Supply Management

Part IX : Verification of Analog and Mixed-Signal Systems
Chapter 71 : Introduction
Chapter 72 : Model-Based Verification
Chapter 73 : Event-Driven Mixed-Signal Modeling Techniques for System-in-Package Functional Verification

Part X : Packaging for Extreme Environments
Chapter 74 : Introduction
Chapter 75 : Electronic Packaging Approaches for Low-Temperature Environments
Chapter 76 : Electronic Packaging Approaches for High-Temperature Environments
Chapter 77 : Failure Analysis of Electronic Packaging
Chapter 78 : Silicon Carbide Power Electronics Packaging

Part XI : Real-World Extreme Environment Applications
Chapter 79 : Introduction
Chapter 80 : A SiGe Remote Sensor Interface
Chapter 81 : A SiGe Remote Electronics Unit
Chapter 82 : Distributed Motor Controller for Operation in Extreme Environments
Chapter 83 : Radiation-Hard Multichannel Digitizer ASIC for Operation in the Jovian Environment
Chapter 84 : Approaches to Commercial Communications Satellite Design
Chapter 85 : UHF Micro-Transceiver Development Project
Chapter 86 : Down-Hole Instrumentation Package for Energy Well Drilling
Chapter 87 : Electronics Requirements for Collider Physics Experiments
Chapter 88 : Cryogenic Electronics for High-Energy Physics Experiments
Chapter 89 : Radar Systems for Extreme Environments

Part XII : Appendices
Appendix A : Properties of Silicon and Germanium
Appendix B : Temperature and Energy Scales
Appendix C : Planetary Temperature Ranges and Radiation Levels
Appendix D : Ionizing Radiation Test Facilities
Appendix E : Radiation Testing Protocols and Mil-Spec Standards
Appendix F : Primer on the Semiconductor Transport Equations and Their Solution
Appendix G : Primer on MOSFETs
Appendix H : Primer on Si and SiGe Bipolar Transistors
Appendix I : Compendium of NASA’s COTS Radiation Test Data
Appendix J : Compendium of NASA’s COTS Cryogenic Test Data
Index