This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as:
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printed wiring boards and laminates
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various types of components and packages
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materials and processes
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fundamentals of reliability and relevant reliability enhancement methods, and
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typical failures observed are described.
A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
Dedication
Preface
Foreword
Acknowledgments
Chapter 1 : Introduction
Chapter 2 : Substrate and Laminate Technologies
Chapter 3 : First-Level Packaging - Packaging and Component Technologies
Chapter 4 : Package-to-Board Interconnection
Chapter 5 : System Packaging
Chapter 6 : Reliability of Electronic Packaging
Chapter 7 : Failure Modes and Mechanisms
Chapter 8 : Reliability Enhancements
Chapter 9 : Emerging Trends in Packaging
Appendixes
Author Biography
Index
