This volume serves as a comprehensive guide to copper plating technology. The contents have been written by a team of experts who
cover all aspects of copper plating processes, including deposition and process details, process control, quality assurance, the properties of the deposited copper, and the effects of deposition parameters on properties. The volume also covers related technologies such as electroforming, patination (coloring) of copper, and the use of copper in electronics (for printed wiring boards and integrated circuits) and in the automotive industry. Includes a database with some 8000 abstracts covering all aspects of the surface treatment of copper and its alloys.
Acknowledgements
Chapter 1 : Introducing Copper
Chapter 2 : Electrodeposition of Copper and its Alloys
Chapter 3 : The Technology of Electrodeposition of Copper and Copper Alloys
Chapter 4 : The Properties of Copper and Copper Alloy Coatings
Chapter 5 : The Application of Electrodeposited Copper and Copper Alloy Coatings
Chapter 6 : Electrolessly Deposited Copper Coatings
Chapter 7 : Properties of Electroless Copper Coatings
Chapter 8 : Quality Assurance, Analysis and Process Optimization in Copper Deposition
Chapter 9 : Stripping of Copper and Copper Alloy Coatings
Chapter 10 : Recycling and Effluent Treatment
Chapter 11 : Copper in Microtechnology
Chapter 12 : Copper in Printed Circuit Board Technology
Appendix
Index
