The book focuses on the tribology of diamond and diamond cutting tools. It fills the gap in the knowledge that relates diamond wear to tool wear and focuses on bond-abrasive-workpiece interactions. The book characterizes the study of wear of single abrasive grains then explains the effect of bonding on the wear ratios one would expect in grinding with bonded abrasive grains. The book contains example calculations and will relate the study of tribology and materials to industrial manufacturing processes such as grinding, lapping, and polishing, etc.
