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Adhesives Technology for Electronic Applications : Materials, Processing, Reliability, 2nd Edition

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Title: Adhesives Technology for Electronic Applications : Materials, Processing, Reliability, 2nd Edition
Author: Dale W. Swanson, James J. Licari
ISBN: 1437778895 / 9781437778892
Format: Hard Cover
Pages: 512
Publisher: Elsevier
Year: 2011
Availability: 45-60 days
     
 
  • Description
  • Contents

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.

The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.

Chapter 1 : Introduction
Chapter 2 : Functions and Theory of Adhesives
Chapter 3 : Chemistry, Formulation, and Properties of Adhesives
Chapter 4 : Adhesive Bonding Properties
Chapter 5 : Applications
Chapter 6 : Reliability
Chapter 7 : Test and Inspection Methods

Appendix
Conversion Factors
Abbreviations and Acronyms
Index

 
 
 
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